Difference in activated atomic steps on (111) silicon surface during KOH and TMAH etchingSATO, Kazuo; MASUDA, Takehiro; SHIKIDA, Mitsuhiro et al.Sensors and materials. 2003, Vol 15, Num 2, pp 93-99, issn 0914-4935, 7 p.Article

Fabrication of sub-20 nm nanostructures by combination of nano plastic forming and etching (NPFE)RASHIDI, Hassan; YOSHINO, Masahiko.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 9, issn 0960-1317, 095003.1-095003.10Article

Reflectivity of an etched silicon surface with pyramids: II. Experimental results from different etching conditionsCHEN JIAN WU; WEI, Pal-Jen; JEN FIN LIN et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 12, issn 0960-1317, 125019.1-125019.6Article

A cellular automaton-based simulator for silicon anisotropic etching processes considering high index planesZHOU, Zai-Fa; HUANG, Qing-An; LI, Wei-Hua et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S38-S49Article

Faster simulations of step bunching during anisotropic etching : formation of zigzag structures on Si(1 10)GOSALVEZ, M. A; XING, Y; HYNNINEN, T et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S27-S37Conference Paper

A novel process for perfect convex corner realization in bulk micromachiningPAL, Prem; CHANDRA, Sudhir.Journal of micromechanics and microengineering (Print). 2004, Vol 14, Num 10, pp 1416-1420, issn 0960-1317, 5 p.Article

Effect of magnesium in KOH solution on anisotropic wet etching of siliconTANAKA, Hiroshi; DI CHENG; INOUE, Kazuyuki et al.International symposium on micro-nano mechatronics and human science. 2004, pp 121-125, isbn 0-7803-8607-8, 1Vol, 5 p.Conference Paper

A phase-change type micropump with aluminum flap valvesWOO YOUNG SIM; HYEUN JOONG YOON; OK CHAN JEONG et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 286-294, issn 0960-1317, 9 p.Article

A model explaining mask-corner undercut phenomena in anisotropic silicon etching: a saddle point in the etching-rate diagramSHIKIDA, Mitsuhiro; NANBARA, Ken-Ichi; KOIZUMI, Tohru et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 758-763, issn 0924-4247, 6 p.Conference Paper

Exploring the activation energy during nanoscale structural evolution in wet etchingGOSALVEZ, M. A; SATO, K.International symposium on micro-nano mechatronics and human science. 2004, pp 127-132, isbn 0-7803-8607-8, 1Vol, 6 p.Conference Paper

Elastomer microspring arrays for biomedical sensors fabricated using micromachined silicon moldsVAN HOUT, Jacha I; SCHEURER, Jörg; CASEY, Vincent et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 6, pp 885-891, issn 0960-1317, 7 p.Article

Advanced sacrificial poly-Si technology for fluidic systemsBERENSCHOT, J. W; TAS, N. R; LAMMERINK, T. S. J et al.Journal of micromechanics and microengineering (Print). 2002, Vol 12, Num 5, pp 621-624, issn 0960-1317Article

Minimizing the effects of hardware marginality on charging damage during plasma-enhanced chemical vapor dielectric depositionCACCIATO, Antonio.Journal of the Electrochemical Society. 2001, Vol 148, Num 12, pp F207-F211, issn 0013-4651Article

Macroporous silicon-based deep anisotropic etchingTAO, Yi; ESASHI, Masayoshi.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 4, pp 764-770, issn 0960-1317, 7 p.Article

Anisotropic etching of silicon in a two-component alkaline solutionVAZSONYI, E; VERTESY, Z; TOTH, A et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 165-169, issn 0960-1317, 5 p.Article

Fast prototyping of high-aspect ratio, high-resolution X-ray masks by gas-assisted focused ion beamKHAN MALEK, C; HARTLEY, F. T; NEOGI, J et al.Microsystem technologies. 2003, Vol 9, Num 6-7, pp 409-412, issn 0946-7076, 4 p.Article

Atomistic methods for the simulation of evolving surfacesGOSALVEZ, M. A; XING, Y; SATO, K et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 5, issn 0960-1317, 055029.1-055029.17Article

An atomistic introduction to anisotropic etchingGOSALVEZ, M. A; SATO, K; FOSTER, A. S et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S1-S26Conference Paper

Silicon test object of the linewidth of the nanometer range for SEM and AFMNOVIKOV, Yu. A; GAVRILENKO, V. P; OZERIN, Yu. V et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 66480R.1-66480R.11, issn 0277-786X, isbn 978-0-8194-6796-6, 1VolConference Paper

Micromachining using ultrasonic impact grindingMEDIS, Praveen S; HENDERSON, H. Thurman.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 8, pp 1556-1559, issn 0960-1317, 4 p.Article

MEMS helmholtz coils for magnetic resonance imagingSYMS, R. R. A; AHMAD, M. M; YOUNG, I. R et al.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 7, pp S1-S9, issn 0960-1317Conference Paper

The structure of an underetched convex mask corner explained as the evolution of a saddlepoint vertexVAN SUCHTELEN, Jaap; VAN VEENENDAAL, Erik.Sensors and materials. 2001, Vol 13, Num 6, pp 325-342, issn 0914-4935Article

In situ observation of oxygen-induced anisotropic surface etching processes at 6H-SiC(0 0 0 1) by variable temperature scanning tunneling microscopeOKADO, H; KUBO, O; YAMAOKA, N et al.Applied surface science. 2003, Vol 212-13, pp 575-578, issn 0169-4332, 4 p.Conference Paper

Etched profile control in anisotropic etching of silicon by TMAH+TritonPAL, Prem; GOSALVEZ, M. A; SATO, K et al.Journal of micromechanics and microengineering (Print). 2012, Vol 22, Num 6, issn 0960-1317, 065013.1-065013.9Article

Fabrication of a vertical sidewall using double-sided anisotropic etching of (10 0) oriented siliconKIM, Hyun-Seok; KIM, Jung-Mu; BANG, Yong-Seung et al.Journal of micromechanics and microengineering (Print). 2012, Vol 22, Num 9, issn 0960-1317, 095014.1-095014.11Article